Multi-Chip Product Packaging Technology |
Helps reduce board size and placement costs by using one component instead of three discrete components |
Small package |
Features 13 x 13 x 1.4 mm package, 0.65 ball pitch, 294 balls |
Scalability within same footprint |
Reduces design cycles by allowing derivative configurations (from high-end to entry-level) in the same package and same ball footprint, helping eliminate the need to redesign PCB and allows pin-for-pin drop-in of alternate configurations |
High-performance, low-power Intel XScale® technology core at 200, 300 and 400 MHz |
Ideal for wireless devices that require low power and advanced application performance. ARM* v.5TE ISA compliant |
Micro-power management |
Offers low-power modes and �Turbo mode� application to improve processing acceleration with efficient power consumption |
Intel® Media Processing Technology |
Helps optimize audio and video multimedia functionality through an integrated 40-bit accumulator |
Enhanced Memory Controller |
Supports low power 2.5V to 3.3V 32- and 16-bit memories as well as glue-less burst and page mode interfaces with synchronous Intel StrataFlash® memory |
Storage Card support |
Supports industry-standard expandable storage and I/O devices, including Multi-Media, Secure Digital and CompactFlash cards |
USB Client |
Fast host synchronization with USB host |
Cellular baseband interface |
Efficient communications integration with cellular baseband |
920 Kbs Bluetooth** interface |
Broad inter-device communication through industry-standard wireless link |
Intel StrataFlash® Memory 16 MegaBytes or 32 MegaBytes K3 |
Efficient communications integration with cellular baseband |
** Bluetooth is a trademark owned by its proprietor and used by Intel Corporation under license. |