MCC LAUNCHES MICRO-ELECTRO-MECHANICAL SYSTEMS INVESTIGATION

Heterogeneous Component Integration Study Addresses Challenges in Pushing This Strategic Technology from Lab to Market

AUSTIN, Texas-April 27, 1998-The Microelectronics and Computer Technology Corporation (MCC) has launched an investigation of the technology, infrastructure, and business challenges surrounding the continued development and integration of micro-electro-mechanical systems (MEMS) with other system components.

MEMS are micro-scale structures that incorporate moving parts, electrical, optical, and other components. They are currently used primarily in automotive applications. MCC's investigation is driving towards large-scale implementation in communications and navigation systems, including RF devices for wireless systems, tunable RF filters, optical switching systems, and phone-on-a-chip (the integration of all components in a phone onto one integrated circuit). In aerospace, applications include unmanned air vehicles, global positioning systems, and inertial navigation systems.

MCC believes that implementing MEMS in these types of systems will lead to products that are smaller, cheaper, and with richer functionality.

"MEMS is a promising technology that is expected to be a $10-14 billion market by 2001," says Gary Tritle, 3M's manager, technology business assessment. "A key challenge for 3M is MEMS integration with other components, which is critical to transitioning this leading-edge university research technology into products." 3M is a Shareholder member of MCC and is participating in requirements definition.

Additional MCC member companies currently participating in requirements definition include Hewlett Packard, Honeywell, Hughes Electronics, Lockheed Martin, Motorola, Nortel, and Raytheon. Key university researchers for the University of Michigan, University of California, Los Angeles, and the University of Texas are also collaborating.

MCC believes that in order to accomplish broad implementation of MEMS technology in these emerging application areas, it must be integrated with other system components such as processors, optoelectronic integrated circuits, and radio frequency (RF) transmit and receive circuitry. Currently, MEMS high-profile consumer applications are automotive accelerometers used in air bag trigger circuits and engine manifold pressure sensors.

The investigation, called Heterogeneous Component Integration (HCI), will conclude this summer and will produce a plan for longer-term research.

Shareholder and Associate members of MCC are entitled to participate in short-term technology feasibility studies, such as HCI. MCC undertakes four to six studies per year and each lasts approximately of 3-6 months. The studies investigate a range of technology areas in order to identify associated research and development opportunities for collaborative projects. The cost of the studies is paid from the members' annual membership fees, which provides considerable leverage.

About MCC

Since 1983, MCC has been among the leading technology research and development consortia. MCC provides next-generation technology solutions and services for its member's mission-critical applications in advanced electronics and information technology. Owned by 18 leading corporations, MCC provides a rich environment for multidisciplinary research and development, technology sourcing, and technology integration with a pervasive commitment to accelerating the creation, commercialization, and adoption of innovation in information technologies and advanced electronics.

Visit MCC's World Wide Web home page at http://www.mcc.com.